Precision FIB-SEM with live endpoint control for confident, repeatable workflows

ZEISS Crossbeam 750 is engineered for precision and clarity in TEM lamella preparation, 3D tomography, and nanofabrication, meeting the demands of advanced semiconductor and materials research workflows. With Gemini 4 optics and High Dynamic Range (HDR) Mill + SEM, it delivers live, high-resolution imaging during milling, enabling confident endpoint control and repeatable sub-20 nm lamella preparation — even for most complex device architectures and demanding samples.

Unmatched imaging performance
Gemini 4 optics deliver high-resolution visibility during milling.

Live see while you mill clarity
HDR Mill + SEM enables real-time imaging at any sample tilt for confident endpoint control.

Precise sub-20 nm lamella preparation
Achieve ultra-thin lamellae with repeatable accuracy.

Reliable repeatability
Recipe-based workflows and logging ensure consistent results across samples and operators.

More information can be found here.